Volume 24, Issue 11 (November 2024)
Modares Mechanical Engineering 2024, 24(11): 29-34 |
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Investigating the Effect of Heat Sink Fin Geometry on Laptop Processor Cooling Using Computational Fluid Dynamics. Modares Mechanical Engineering 2024; 24 (11) :29-34
URL: http://mme.modares.ac.ir/article-15-79202-en.html
URL: http://mme.modares.ac.ir/article-15-79202-en.html
Abstract: (510 Views)
In this study, the cooling process of a laptop processor is investigated and simulated. The geometry in question consists of a heat pipe and a heat sink with fins, and the cooling process is simulated in the ANSYS Fluent software. Using the simulation results, the effect of six different geometries for the aluminum heat sink fins on the cooling rate and temperature of the laptop processor is investigated. The geometries evaluated include rectangular, triangular, wavy, rectangular with holes, rectangular with pins, and rectangular with appendages. Air passes over the fins at a speed of 1 m/s and the air flow is considered turbulent. For all geometries under study, it is assumed that a heat flux of 70 kW/m2 is transferred from the heat pipe to the top of the heat sink. The results show that using the wavy fin geometry leads to increased heat transfer from the top surface of the heatsink, resulting in a reduction in the processor surface temperature (up to 63 °C). Also, using triangular fins leads to a temperature of 149 °C on the processor surface, which is inappropriate and can cause damage to it
Article Type: Original Research |
Subject:
Micro & Nano Systems
Received: 2025/01/27 | Accepted: 2024/10/22 | Published: 2024/10/22
Received: 2025/01/27 | Accepted: 2024/10/22 | Published: 2024/10/22
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